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Failure analysis of leakage current in plastic encapsulated packages

โœ Scribed by S. J. Hu; F. T. Cheang

Book ID
112823365
Publisher
Springer US
Year
1990
Tongue
English
Weight
322 KB
Volume
19
Category
Article
ISSN
0361-5235

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โœ Tadashi Yoshihara; Yasuhide Ohno; Akinobu Kusuhara; Hiroshi Fujita; Masakatsu Ma ๐Ÿ“‚ Article ๐Ÿ“… 1999 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 455 KB ๐Ÿ‘ 2 views

Wire sweep, a problem in plastic encapsulated IC packages, is investigated with real encapsulated packages. For the mechanical characteristics of the wire, the wire sweep becomes smaller for a wire with a larger Youngs modulus, as expected [1]. In regard to the characteristics of the molding compoun