Effects of molding compound on wire sweep in plastic encapsulated IC packages
✍ Scribed by Tadashi Yoshihara; Yasuhide Ohno; Akinobu Kusuhara; Hiroshi Fujita; Masakatsu Maeda
- Publisher
- John Wiley and Sons
- Year
- 1999
- Tongue
- English
- Weight
- 455 KB
- Volume
- 82
- Category
- Article
- ISSN
- 8756-663X
No coin nor oath required. For personal study only.
✦ Synopsis
Wire sweep, a problem in plastic encapsulated IC packages, is investigated with real encapsulated packages. For the mechanical characteristics of the wire, the wire sweep becomes smaller for a wire with a larger Youngs modulus, as expected [1]. In regard to the characteristics of the molding compound, the wire sweep is smaller in biphenyl-type than Novolak-type compounds. In both compounds, the wire sweep is larger if the filler content is higher. When the wire sweep is compared between molding compounds with different filler contents with similar viscosity, the wire sweep is found to be larger in the case of a higher filler content. Hence, it is undesirable to use the viscosity as a parameter to predict the wire sweep from the molding compound.