Analytical solutions of thermal stress distribution in plastic encapsulated integrated circuit packages

✍ Scribed by Liu Yu-lan; Wang Biao; Wang Dian-fu

• Book ID: 105574772
• Publisher: Springer
• Year: 2003
• Tongue: English
• Weight: 521 KB
• Volume: 24
• Category: Article
• ISSN: 0253-4827
• DOI: 10.1007/bf02437623