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Evaluation of epoxy underfill materials for solder flip-chip technology

✍ Scribed by C. E. PARK; B. J. HAN; H. E. BAIR; V. R. RAJU

Book ID
110372687
Publisher
Springer
Year
1997
Tongue
English
Weight
160 KB
Volume
16
Category
Article
ISSN
0261-8028

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## Abstract No‐flow underfill is used in the assembly of microelectronics to increase the productivity and to decrease the cost of the flip‐chip manufacturing. The curing process, especially the gelation of the no‐flow underfill, is essential for the yield and reliability of the flip‐chip assembly.