Adhesion and Evaluation of Thermoplastic Nonconductive Film Materials in Flip Chip for Fine-Pitch Chip-on-Flex

✍ Scribed by Chin-Tang Hsieh; Kun-Hou Liao; Guo-Ju Chen; Chen-Mu Lee; Hung-Jan Lin; Kai-Jen Cheng

• Book ID: 119815782
• Publisher: Institute of Electrical and Electronics Engineers
• Year: 2011
• Tongue: English
• Weight: 934 KB
• Volume: 1
• Category: Article
• ISSN: 2156-3950
• DOI: 10.1109/tcpmt.2011.2114884