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Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

✍ Scribed by W. K. Chiang; Y. C. Chan; Brian Ralph; Andrew Holland

Book ID: 110626665
Publisher: Springer US
Year: 2006
Tongue: English
Weight: 386 KB
Volume: 35
Category: Article
ISSN: 0361-5235
DOI: 10.1007/bf02690531

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