Fine pitch stencil printing of Sn/Pb and lead free solders for flip chip technology

✍ Scribed by Kloeser, J.; Heinricht, K.; Kutzner, K.; Jung, E.; Ostmann, A.; Reichl, H.

• Book ID: 114560644
• Publisher: IEEE
• Year: 1998
• Weight: 519 KB
• Volume: 21
• Category: Article
• ISSN: 1083-4400
• DOI: 10.1109/3476.670027