Pirani pressure sensor for smart wafer-l
โ
F. Mailly; N. Dumas; N. Pous; L. Latorre; O. Garel; E. Martincic; F. Verjus; C.
๐
Article
๐
2009
๐
Elsevier Science
๐
English
โ 911 KB
Systems in Package (SiP) contain an increasing number of MEMS components such as resonators for time references or RF filtering. These resonators are packaged at wafer level and the cavity quality has to be guaranteed in terms of pressure and moisture level by the final manufacturing test. Therefore