✦ LIBER ✦
Wafer-Level Parylene Packaging With Integrated RF Electronics for Wireless Retinal Prostheses
✍ Scribed by Wen Li; Rodger, D.C.; Meng, E.; Weiland, J.D.; Humayun, M.S.; Yu-Chong Tai
- Book ID
- 118228476
- Publisher
- IEEE
- Year
- 2010
- Tongue
- English
- Weight
- 901 KB
- Volume
- 19
- Category
- Article
- ISSN
- 1057-7157
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