✦ LIBER ✦

Electromigration Failure Mechanism in Sn-Cu Solder Alloys with OSP Cu Surface Finish

✍ Scribed by Ming-Hui Chu, S.W. Liang, Chih Chen, Annie T. Huang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Electromigration-Induced Failure of Ni/C

✍ Y. H. Hsiao; H. W. Tseng; C. Y. Liu 📂 Article 📅 2009 🏛 Springer US 🌐 English ⚖ 457 KB

Intermetallics Evolution in Sn-3.5Ag Bas

✍ Feng Gao; Hiroshi Nishikawa; Tadashi Takemoto 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 443 KB

Suppressing Ni3Sn4 formation in the Sn–A

✍ Chien-Fu Tseng; Tae-Kyu Lee; Gnyaneshwar Ramakrishna; Kuo-Chuan Liu; Jenq-Gong D 📂 Article 📅 2011 🏛 Elsevier Science 🌐 English ⚖ 836 KB

Interfacial reactions of Sn–Cu solder wi

✍ M.N. Islam; Y.C. Chan 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 503 KB

Intermetallic Reactions in Sn-0.4Co-0.7C

✍ T.H. Chuang; C.C. Jain; H.M. Wu 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 888 KB

Intermetallic formation in Sn3Ag0.5Cu an

✍ Tung-Han Chuang; Shiu-Fang Yen; Hui-Min Wu 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 765 KB