✦ LIBER ✦
Intermetallics Evolution in Sn-3.5Ag Based Lead-Free Solder Matrix on an OSP Cu Finish
✍ Scribed by Feng Gao; Hiroshi Nishikawa; Tadashi Takemoto
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 443 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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