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Electromigration effect on intermetallic growth and Young’s modulus in SAC solder joint

✍ Scribed by Luhua Xu; John H. L. Pang; Fei Ren; K. N. Tu

Book ID
107453829
Publisher
Springer US
Year
2006
Tongue
English
Weight
517 KB
Volume
35
Category
Article
ISSN
0361-5235

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✍ Yu-Dong Lu; Xiao-Qi He; Yun-Fei En; Xin Wang; Zhi-Qiang Zhuang 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 695 KB

The polarity effect of electromigration on the interfacial reactions of micro ball grid array (lBGA) solder joints was studied in terms of microstructural evolution. A dummy lBGA package with the same pair of solder joints was used to obtain reproducible results for a practical application. The lBGA