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Effect of Intermetallic on Electromigration and Atomic Diffusion in Cu/SnAg3.0Cu0.5/Cu Joints: Experimental and First-Principles Study

โœ Scribed by Wei Zhou; Lijuan Liu; Baoling Li; Ping Wu

Book ID
107455478
Publisher
Springer US
Year
2009
Tongue
English
Weight
485 KB
Volume
38
Category
Article
ISSN
0361-5235

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