Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4Solutions

✍ Scribed by Ja-Young Jung; Shin-Bok Lee; Ho-Young Lee; Young-Chang Joo; Young-Bae Park

• Book ID: 107455219
• Publisher: Springer US
• Year: 2008
• Tongue: English
• Weight: 529 KB
• Volume: 37
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-008-0491-7