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Electrochemical Migration Characteristics of Eutectic Sn-Pb Solder Alloy in NaCl and Na2SO4Solutions

โœ Scribed by Ja-Young Jung; Shin-Bok Lee; Ho-Young Lee; Young-Chang Joo; Young-Bae Park

Book ID
107455357
Publisher
Springer US
Year
2009
Tongue
English
Weight
1016 KB
Volume
38
Category
Article
ISSN
0361-5235

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โœ F. Rosalbino; E. Angelini; G. Zanicchi; R. Carlini; R. Marazza ๐Ÿ“‚ Article ๐Ÿ“… 2009 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 912 KB

## a b s t r a c t The corrosion behaviour of Sn-3Ag-3Cu (at%) alloy was investigated in 0.1 M NaCl solution by potentiodynamic polarization and impedance spectroscopy measurements and compared with that of the Sn-3Ag-0.5Cu (at%) solder employed in the packaging of some microelectronic components