✦ LIBER ✦
Recent advances on kinetic analysis of electromigration enhanced intermetallic growth and damage formation in Pb-free solder joints
✍ Scribed by Brook Huang-Lin Chao; Xuefeng Zhang; Seung-Hyun Chae; Paul S. Ho
- Book ID
- 108210797
- Publisher
- Elsevier Science
- Year
- 2009
- Tongue
- English
- Weight
- 957 KB
- Volume
- 49
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.