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Effects of multi-layer graphene capping on Cu interconnects

โœ Scribed by Kang, Chang Goo; Lim, Sung Kwan; Lee, Sangchul; Lee, Sang Kyung; Cho, Chunhum; Lee, Young Gon; Hwang, Hyeon Jun; Kim, Younghun; Choi, Ho Jun; Choe, Sun Hee; Ham, Moon-Ho; Lee, Byoung Hun

Book ID
120248837
Publisher
Institute of Physics
Year
2013
Tongue
English
Weight
919 KB
Volume
24
Category
Article
ISSN
0957-4484

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Effect of capping layer and post-CMP sur
Effect of capping layer and post-CMP surface treatments on adhesion between damascene Cu and capping layer for ULSI interconnects
โœ Seol-Min Yi; Cheonman Shim; Han-Choon Lee; Jae-Won Han; Kee-Ho Kim; Young-Chang ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 378 KB

The effect of the type of capping layer and post-CMP surface treatments on the adhesion between damascene Cu and the capping layer was investigated. The CMPed-surface was treated by six methods divided into four groups which consisted of no surface treatment, cleaning by plasma with vacuum break, cl