Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects

✍ Scribed by S Balakumar; Grace Wong; Chi Fo Tsang; T Hara; W.J Yoo

• Book ID: 108207350
• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 325 KB
• Volume: 75
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2004.05.003