Enhancement of adhesion strength of Cu layer with low dielectric constant SiC:H liners in Cu interconnects

✍ Scribed by Grace Wang; S. Balakumar; S.C. Hwee; Rakesh Kumar; T. Hara

• Book ID: 104050924
• Publisher: Elsevier Science
• Year: 2005
• Tongue: English
• Weight: 313 KB
• Volume: 36
• Category: Article
• ISSN: 0026-2692
• DOI: 10.1016/j.mejo.2004.11.010