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Effects of mechanical characteristics on the chemical-mechanical polishing of dielectric thin films

✍ Scribed by Wei-Tsu Tseng; Chi-Wen Liu; Bau-Tong Dai; Ching-Fa Yeh

Book ID
114086086
Publisher
Elsevier Science
Year
1996
Tongue
English
Weight
446 KB
Volume
290-291
Category
Article
ISSN
0040-6090

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The effects of polishing pressure and abrasive on the chemical mechanical polishing of blanket and patterned aluminum thin films were investigated. The CMP process experiments were conducted using a soft pad and slurry mainly composed of acid solution and Al O abrasive. The result of the blanket fil