The effects of polishing pressure and abrasive on the chemical mechanical polishing of blanket and patterned aluminum thin films were investigated. The CMP process experiments were conducted using a soft pad and slurry mainly composed of acid solution and Al O abrasive. The result of the blanket fil
โฆ LIBER โฆ
Chemical mechanical polishing of PZT thin films for FRAM applications
โ Scribed by Yong-Jin Seo; Jin-Seong Park; Woo-Sun Lee
- Book ID
- 108207666
- Publisher
- Elsevier Science
- Year
- 2006
- Tongue
- English
- Weight
- 447 KB
- Volume
- 83
- Category
- Article
- ISSN
- 0167-9317
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