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Chemical mechanical polishing of nickel for applications in MEMS devices

✍ Scribed by Tianbao Du; Arun Vijayakumar; Kalpathy B Sundaram; Vimal Desai

Book ID
108207352
Publisher
Elsevier Science
Year
2004
Tongue
English
Weight
254 KB
Volume
75
Category
Article
ISSN
0167-9317

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## Abstract Chemical‐mechanical polishing (CMP) allows the planarization of wafers with thin layer at its surface. Subject of this investigation was to apply CMP for planarizing silicon nitride (Si~3~N~4~) passivation layer in high power III‐V laser devices, which remained in the structure as the i