𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Chemical mechanical polishing of polymeric materials for MEMS applications

✍ Scribed by Z.W. Zhong; Z.F. Wang; Y.H. Tan

Publisher
Elsevier Science
Year
2006
Tongue
English
Weight
287 KB
Volume
37
Category
Article
ISSN
0026-2692

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A fundamental model proposed for materia
A fundamental model proposed for material removal in chemical–mechanical polishing
✍ J. Xin; W. Cai; J.A. Tichy 📂 Article 📅 2010 🏛 Elsevier Science 🌐 English ⚖ 431 KB

So far there is no consensus on the fundamental mechanism of material removal in chemical-mechanical polishing (CMP). Some researchers model the CMP process based on the mechanism proposed by Kaufman et al. [1], who attribute the material removal from the wafer surface to chemistry-aided mechanical