At present, the electronic packaging industry is actively searching for leadโfree (Pbโfree) solders due to environmental concerns over Pbโcontaining solders. For a successful transition to Pbโfree manufacturing in electronics assembly, it is critical to understand the behavior of Pbโfree solders. We
Effect of temperature on surface composition of Cu-Sn and Ag-Sn alloys; an ESCA study
โ Scribed by R.I. Hegde; A.P.B. Sinha
- Publisher
- Elsevier Science
- Year
- 1983
- Weight
- 50 KB
- Volume
- 133
- Category
- Article
- ISSN
- 0167-2584
No coin nor oath required. For personal study only.
๐ SIMILAR VOLUMES
The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the
Age hardening in Cu-9Ni-2Sn and Cu-9Ni-5Sn alloys at 573 and 673 K is studied. After an incubation period (+ 10%) strengthening appears which is due to precipitates in the Cu-9Ni-2Sn alloys. On the other hand an immediate increase of the yield stress characterizes the annealing of the Cu-9Ni-5Sn all
## Abstract Corrosion properties of three different SnโAg lead free solder alloys have been investigated in 0.3 wt% Na~2~SO~4~ solution as corrosive environment. As cast solder alloy was analyzed by Xโray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag~3~Sn in t