Aging study of rapidly solidified and solid-solution Cu–Cr–Sn–Zn alloy

✍ Scribed by Juan-hua Su; Ping Liu; Qi-ming Dong; He-jun Li; Feng-zhang Ren

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 589 KB
• Volume: 205
• Category: Article
• ISSN: 0924-0136
• DOI: 10.1016/j.jmatprotec.2007.11.184

✦ Synopsis

The effects of different solution methods on aging microstructure and properties of Cu-Cr-Sn-Zn alloy have been studied. The grain size of rapid solidification is much smaller than solid-solution grain size. Strengthening of smaller grain size is obvious. There are much more fine precipitates in the rapidly solidified aging than in the solid-solution aging which accounts for the increase in hardness and conductivity of Cu-Cr-Sn-Zn alloy. Under 920 • C for 1 h solid solution and 500 • C aging for 15 min, the hardness and electrical conductivity can reach 102 HV and 51.4%IACS, respectively. On rapid solidification and the same aging condition, the hardness and electrical conductivity can reach 178 HV and 60.6%IACS, respectively.