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Effect of polyimide baking on bump resistance in flip-chip solder joints

✍ Scribed by Cheng, Hsi-Kuei; Feng, Shien-Ping; Lai, Yi-Jen; Liu, Kuo-Chio; Wang, Ying-Lang; Liu, Tzeng-Feng; Chen, Chih-Ming

No coin nor oath required. For personal study only.

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