✦ LIBER ✦
Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results
✍ Scribed by S. W. Liang; Y. W. Chang; Chin Chen; Y. C. Liu; K. H. Chen; S. H. Lin
- Publisher
- Springer US
- Year
- 2006
- Tongue
- English
- Weight
- 341 KB
- Volume
- 35
- Category
- Article
- ISSN
- 0361-5235
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