The effect of different plasma treatments on the interfacial bonding configurations and adhesion strengths between porous SiOCH ultra-low-dielectric-constant film and SiCN etch stop layer have been investigated in this study. From X-ray photoelectron spectroscopic analyses, interlayer regions of abo
Effect of plasma treatments on ultra low-k material properties
β Scribed by A. Humbert; L. Mage; C. Goldberg; K. Junker; L. Proenca; J.B. Lhuillier
- Publisher
- Elsevier Science
- Year
- 2005
- Tongue
- English
- Weight
- 210 KB
- Volume
- 82
- Category
- Article
- ISSN
- 0167-9317
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