𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Experimental results on the integration of copper and CVD ultra low k material

✍ Scribed by Matthias Uhlig; A. Bertz; J.-W. Erben; S.E. Schulz; T. Gessner; D. Zeidler; C. Wenzel; J. Bartha

Publisher
Elsevier Science
Year
2003
Tongue
English
Weight
329 KB
Volume
70
Category
Article
ISSN
0167-9317

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Impact of material/process interactions
Impact of material/process interactions on the properties of a porous CVD-O3 low-k dielectric film
✍ Y Travaly; B Eyckens; L Carbonel; A Rothschild; Q.T Le; S.H Brongersma; I Ciofi; πŸ“‚ Article πŸ“… 2002 πŸ› Elsevier Science 🌐 English βš– 784 KB

The impact of material / process interactions on low temperature CVD-O low-k dielectric film properties are 3 presented. The film under investigation is deposited following a three-step process consisting of a low temperature chemical vapor deposition (CVD), an ex situ high temperature cure in a con

New experimental results on the static a
New experimental results on the static and the transient anomalous Kapitza conductance of clean copper to4He interfaces
✍ K. C. Rawlings; J. C. A. Sluijs πŸ“‚ Article πŸ“… 1978 πŸ› Springer US 🌐 English βš– 626 KB

Experiments are described on the power dependence of the Kapitza conductance of copper at temperatures between 1 and 2 K. It is shown that the effects found earlier by Cheeke et al. are much enhanced on clean copper surfaces. New transient effects with long delay times up to lO00 sec are reported. I

Characterization of the impact of plasma
Characterization of the impact of plasma treatments and wet cleaning on a porous low k material
✍ W. Puyrenier; V. Rouessac; L. Broussous; D. RΓ©biscoul; A. Ayral πŸ“‚ Article πŸ“… 2006 πŸ› Elsevier Science 🌐 English βš– 271 KB

In the back end of line (BEOL) interconnections for 65 nm and beyond technology nodes, the integration of porous low dielectric constant (low k) materials is now needed to improve signal propagation. Porosity in low k films drives new challenges concerning the different steps of the integration. Thu

On the experimental reproducibility in m
On the experimental reproducibility in measurements of the Kapitza conductance of copper between 1 and 2 K
✍ A.E. Alnaimi; J.C.A. van der Sluijs πŸ“‚ Article πŸ“… 1973 πŸ› Elsevier Science 🌐 English βš– 276 KB

The reproducibility of measurements of the Kapitza conductance between electropolished copper samples and He 4 has been investigated at temperatures between 1.2 and 20 K. It is shown that the results are sensitive to the vacuum treatment to which the sample is subjected. It appears that after leavin