Cu/Ta/Si (100) structures deposited by the non-mass separated ion beam deposition system showed a slight resistivity increase at 650 8C due to a Cu agglomeration. To suppress the Cu agglomeration on the Ta layer, a capping layer was deposited on the Cu/Ta/Si structure using Ta or SiO 2 as a suppress
Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems
β Scribed by T Laurila; K Zeng; J Molarius; T Riekkinen; I Suni; J.K Kivilahti
- Publisher
- Elsevier Science
- Year
- 2002
- Tongue
- English
- Weight
- 613 KB
- Volume
- 64
- Category
- Article
- ISSN
- 0167-9317
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β¦ Synopsis
The effect of oxygen on the reactions in the Si / Ta / Cu and Si / TaC / Cu metallization systems was investigated by utilizing the assessed Ta-O binary and the evaluated ternary Ta-C-O phase diagrams together with detailed transmission electron microscopy (TEM) and secondary ion mass spectrometry analyses (SIMS). The presence of some form of amorphous tantalum oxide at the Ta / Cu and TaC / Cu interfaces was experimentally verified. The formation of the interfacial layers was explained with the help of the assessed phase diagrams as well as with the available kinetic data.
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