✦ LIBER ✦
Void formation in the Cu layer during thermal treatment of SiNx/Cu/Ta73Si27/SiO2/Si systems
✍ Scribed by R. Hübner; R. Reiche; M. Hecker; N. Mattern; V. Hoffmann; K. Wetzig; H. Heuer; Ch. Wenzel; H.-J. Engelmann; E. Zschech
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 413 KB
- Volume
- 40
- Category
- Article
- ISSN
- 0232-1300
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