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Effect of Epoxy Molding Compound on the Electrical Performance of Microelectronic Devices

✍ Scribed by Herbsommer, J. A.

Book ID: 117913389
Publisher: Institute of Electrical and Electronics Engineers
Year: 2012
Tongue: English
Weight: 597 KB
Volume: 2
Category: Article
ISSN: 2156-3950
DOI: 10.1109/tcpmt.2012.2193882

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