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Effect of mold heat transfer on the curing reaction of epoxy molding compound during transfer molding

✍ Scribed by S.Y. Hu; Y.P. Chang; W.R. Jong; S.C. Chen

Book ID: 108011091
Publisher: Elsevier Science
Year: 1996
Tongue: English
Weight: 397 KB
Volume: 23
Category: Article
ISSN: 0735-1933
DOI: 10.1016/0735-1933(96)00061-9

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