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Effects of moisture on properties of epoxy molding compounds

✍ Scribed by M. G. Lu; M. J. Shim; S. W. Kim

Publisher: John Wiley and Sons
Year: 2001
Tongue: English
Weight: 170 KB
Volume: 81
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.1664

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