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Effects of defrosting period on mold adhesion force of epoxy molding compound

✍ Scribed by Hwe-Zhong Chen; Wen-Hung Lee; Huei-Huang Lee; Durn-Yuan Huang; Shyang-Jye Chang; Sheng-Jye Hwang

Publisher
Wiley (John Wiley & Sons)
Year
2009
Tongue
English
Weight
397 KB
Volume
4
Category
Article
ISSN
1932-2135

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