Curing kinetics and viscosity change of a two-part epoxy resin during mold filling in resin-transfer molding process

✍ Scribed by Chang-Lun Lee; Kung-Hwa Wei

• Publisher: John Wiley and Sons
• Year: 2000
• Tongue: English
• Weight: 193 KB
• Volume: 77
• Category: Article
• ISSN: 0021-8995
• DOI: 10.1002/1097-4628(20000906)77:10<2139::aid-app6>3.0.co;2-n