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Effect of Temperature on Water Molecules in a Model Epoxy Molding Compound: Molecular Dynamics Simulation Approach

✍ Scribed by Seung Geol Lee; Ji Il Choi; Wonsang Koh; Seung Soon Jang; Jongman Kim; Gene Kim


Book ID
119815842
Publisher
Institute of Electrical and Electronics Engineers
Year
2011
Tongue
English
Weight
853 KB
Volume
1
Category
Article
ISSN
2156-3950

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