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Dry etching of III–V semiconductors: influence of substrate temperature on the anisotropy and induced damage

✍ Scribed by P Van Daele; D Lootens; P Demeester


Publisher
Elsevier Science
Year
1990
Tongue
English
Weight
268 KB
Volume
41
Category
Article
ISSN
0042-207X

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Laser induced backside dry etching method (LIBDE) was developed -analogously to the well-known laser induced backside wet etching (LIBWE) technique -for the micromachining of transparent materials. In this procedure, the absorbing liquid applied during LIBWE was replaced with solid metal layers. Fus