𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Device-Level Vacuum Packaging for RF MEMS

✍ Scribed by Shahriar Rahman, M.; Chitteboyina, M.M.; Butler, D.P.; Çelik-Butler, Z.; Pacheco, S.P.; McBean, R.V.


Book ID
115537991
Publisher
IEEE
Year
2010
Tongue
English
Weight
834 KB
Volume
19
Category
Article
ISSN
1057-7157

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


LTCC-based vertical via interconnects fo
✍ Yong-Seung Bang; Jung-Mu Kim; Jong-Man Kim; Yong-Kweon Kim; Yun-Ho Jang 📂 Article 📅 2010 🏛 John Wiley and Sons 🌐 English ⚖ 744 KB

Two novel badge-sized extremely low-profile TAG antennas have been developed. They have been manufactured by means of different methods of input impedance tuning. They are aimed at the UHF radiofrequency identification of persons in case of moderate distances. The low-permittivity substrate has been