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Current-voltage characteristics of isotype SiC-SiC junctions fabricated by direct wafer bonding

✍ Scribed by P. A. Ivanov; L. S. Kostina; A. S. Potapov; T. P. Samsonova; E. I. Belyakova; T. S. Argunova; I. V. Grekhov

No coin nor oath required. For personal study only.

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