✦ LIBER ✦
Characteristics of new dielectric isolation wafers for high voltage power IC's by single-Si poly-Si direct bonding (SPSDB) technique
✍ Scribed by Inoue, Y.; Sugawara, Y.; Kurita, S.
- Book ID
- 114536027
- Publisher
- IEEE
- Year
- 1995
- Tongue
- English
- Weight
- 351 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0018-9383
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