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Cure kinetics and rheology characterization of soy-based epoxy resin system

✍ Scribed by G. Liang; K. Chandrashekhara

Publisher: John Wiley and Sons
Year: 2006
Tongue: English
Weight: 715 KB
Volume: 102
Category: Article
ISSN: 0021-8995
DOI: 10.1002/app.24369

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