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Curing kinetics and thermal property characterization of a bisphenol-F epoxy resin and DDO system

โœ Scribed by Gao Jungang; Li Deling; Shen Shigang; Liu Guodong

Publisher
John Wiley and Sons
Year
2001
Tongue
English
Weight
230 KB
Volume
83
Category
Article
ISSN
0021-8995

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Curing kinetics, thermal property, and stability of tetrabromo-bisphenol-A epoxy resin with 4,4โ€ฒ-diaminodiphenyl ether
โœ Yanfang Liu; Min Zhao; Shigang Shen; Jungang Gao ๐Ÿ“‚ Article ๐Ÿ“… 1998 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 225 KB ๐Ÿ‘ 2 views

The curing reaction of tetrabromo-bisphenol-A epoxy resin (TBBPAER) with 4,4ะˆ-diaminodiphenyl ether (DDE) was studied by isothermal differential scanning calorimetry (DSC) in the temperature range of 110 -140ยฐC. The results show that the isothermal cure reaction of TBBPAER-DDE in the kinetic control