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Curing kinetics and thermal property characterization of a bisphenol-S epoxy resin and DDS system

✍ Scribed by Jungang Gao; Yanfang Li

Publisher: John Wiley and Sons
Year: 2000
Tongue: English
Weight: 127 KB
Volume: 49
Category: Article
ISSN: 0959-8103
DOI: 10.1002/1097-0126(200012)49:12<1590::aid-pi548>3.0.co;2-k

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