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Curing kinetics and thermal property characterization of an o-cresol formaldehyde epoxy resin and 4,4′-diaminodiphenyl ether system

✍ Scribed by Jungang Gao; Min Zhao

Publisher
John Wiley and Sons
Year
2004
Tongue
English
Weight
116 KB
Volume
94
Category
Article
ISSN
0021-8995

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