𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Curing and mechanical characterization of a soy-based epoxy resin system

✍ Scribed by Jiang Zhu; K. Chandrashekhara; Virgil Flanigan; Shubhender Kapila

Publisher
John Wiley and Sons
Year
2004
Tongue
English
Weight
94 KB
Volume
91
Category
Article
ISSN
0021-8995

No coin nor oath required. For personal study only.

πŸ“œ SIMILAR VOLUMES

Cure behavior and thermal degradation me
Cure behavior and thermal degradation mechanisms of epoxy and epoxy–cyanate resins
✍ N. RΓ©gnier; M. Fayos; P. Moreau; E. Lafontaine; B. Mortaigne πŸ“‚ Article πŸ“… 1999 πŸ› John Wiley and Sons 🌐 English βš– 248 KB πŸ‘ 2 views

The cure reactions of tetraglycidyl methylene diamine (TGMDA) epoxy cured with tetrasubstituted aromatic diamine on one hand and diglycidyl ether of bisphenol A and diglycicyl ether tetrabromobisphenol A epoxies cured with methylene bis (phenyl-4-cyanate) on the other hand are reported. Systematic F