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Copper pillar bump design optimization for lead free flip-chip packaging

✍ Scribed by K. M. Chen; T. S. Lin

Book ID: 106398411
Publisher: Springer US
Year: 2009
Tongue: English
Weight: 597 KB
Volume: 21
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-009-9905-4

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