✦ LIBER ✦
Enhanced Wettability of Oxidized Copper with Lead-Free Solder by Ar-H2Plasmas for Flip-Chip Bumping
✍ Scribed by Yung-Sen Lin; Chun-Hao Chang; Wei-Jhih Lin
- Book ID
- 107454965
- Publisher
- Springer US
- Year
- 2007
- Tongue
- English
- Weight
- 343 KB
- Volume
- 36
- Category
- Article
- ISSN
- 0361-5235
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