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CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

✍ Scribed by Viorel Dragoi, Eric Pabo, Jürgen Burggraf, Gerald Mittendorfer

Book ID
113047131
Publisher
Springer-Verlag
Year
2012
Tongue
English
Weight
728 KB
Volume
18
Category
Article
ISSN
0946-7076

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A wafer-level adhesive bonding process based on Ordyl SY300, an acrylic permanent dry-film photoresist, is systematically optimized and characterized. Silicon and Pyrex wafers are bonded with a structured 120 m thick layer of Ordyl. A bond yield of 95% and a tensile bond strength of 13.36 MPa are me