Optimization and characterization of wafer-level adhesive bonding with patterned dry-film photoresist for 3D MEMS integration
✍ Scribed by Till Huesgen; Gabriel Lenk; Björn Albrecht; Paul Vulto; Thomas Lemke; Peter Woias
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 501 KB
- Volume
- 162
- Category
- Article
- ISSN
- 0924-4247
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✦ Synopsis
A wafer-level adhesive bonding process based on Ordyl SY300, an acrylic permanent dry-film photoresist, is systematically optimized and characterized. Silicon and Pyrex wafers are bonded with a structured 120 m thick layer of Ordyl. A bond yield of 95% and a tensile bond strength of 13.36 MPa are measured. Membrane-covered cavity structures, that maintain low vacuum pressures in the range of a few kPa over a period of several months, demonstrate leak tightness. The process is applied to fabricate a novel thermopneumatic microvalve with an integrated Peltier-cooler chip for direct temperature control. A wafer-level bond with an Ordyl layer thickness of 20 m is used for the valve chamber and a chip-wafer bond with 120 m thick Ordyl is used to integrate a commercial micro-scale Peltier cooler. Test results indicate the functionality of the microvalve, demonstrating the suitability of Ordyl bonding for 3D MEMS fabrication.